The low thermal conductivity of polymers can be improved with the
incorporation of fillers with a relatively high thermal conductivity.
However, the improvement which can be achieved depends not only on the
filler properties but also on the interaction between the polymer matrix and
fillers. In this study, a variety of polymer composites with surface
modified particles were synthesized. Hexagonal boron nitride-, cubic boron
nitride-and silica-epoxy composites were produced and their thermal
conductivity was determined with the use of the transient plane source
method. The results on the composite thermal conductivity suggest that the
interaction between epoxy and fillers is one of the most important
parameters. A better interaction results in the suppression of phonon
scattering at the numerous interfaces and thus, in a higher composite
thermal conductivity. Also, filler size can affect the performance of the
polymer composites. The decrease of the filler size significantly increases
the surface-to-volume ratio which in turn increases the phonon scattering at
the interfaces. Finally, it seems that the intrinsic thermal conductivity of
fillers slightly contributes to the thermal conductivity of composites
especially when the filler size is smaller than 100 nm. TCi導熱系數儀
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